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6 channel emi filter array with esd protection cm1400-03 ?2010 scillc. all rights reserved. publication order number: april 2010 rev. 3 cm1400-03/d features ? functionally and pin compatible with cspemi306a device ? optiguard ? coated for improved reliability at assembly ? six channels of emi filtering for data ports ? pi-style emi filters in a capacitor-resistor- capacitor (c-r-c) network ? 40db absolute attenuation (typical) at 1 ghz ? 35db attenuation (typical) at 1 ghz relative to pass band ? 15kv esd protection on each channel (iec 61000-4-2 level 4, contact discharge) ? 30kv esd protection on each channel (hbm) ? 15-bump, 2.960mm x 1.330mm footprint chip scale package (csp) ? chip scale package features extremely low lead inductance for optimum filter and esd performance ? rohs compliant (lead-free) finishing applications ? emi filtering and esd protection for both data and i/o ports ? wireless handsets ? handheld pcs / pdas ? mp3 players ? notebooks ? desktop pcs product description the cm1400-03 is a six channel low-pass filter array that reduces emi/rfi emissions while at the same time providing esd protection. it is used on data ports on mobile devices. to reduce emi/rfi emissions, the cm1400-03 int egrates a pi-style filter (c-r-c) for each of the 6 channels. each high quality filter provides greater than 30db attenuation in the 800-2700 mhz range relative to the pass band attenuation. these pi-style filters also support bidirectional filtering, controlling emi both to and from a data port connector. in addition, the cm1400-03 provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (esd). the input pins are designed and characterized to safely dissipate esd strikes of 15kv, exceeding the maximum requirement of the iec 61000-4-2 international standard. using the mil-std-883 (method 3015) specification for human body model (hbm) esd, the device provides protection for contact discharges to greater than 30kv. the cm1400-03 is particularly well suited for portable electronics (e.g., cellular telephones, pdas, notebook computers) because of it s small package footprint and low weight. the cm1400-03 incorporates optiguard ? coating which results in improved reliability at assembly. the cm1400-03 is available in a space-saving, low-profile chip scale package with rohs compliant lead-free finishing.
cm1400-03 rev. 3 | page 2 of 14 | www.onsemi.com block diagram package/pinout diagrams
cm1400-03 rev. 3 | page 3 of 14 | www.onsemi.com pin descriptions pin(s) name description a1 filter1 filter channel 1 a2 filter2 filter channel 2 a3 filter3 filter channel 3 a4 filter4 filter channel 4 a5 filter5 filter channel 5 a6 filter6 filter channel 6 b1-b3 gnd device ground c1 filter1 filter channel 1 c2 filter2 filter channel 2 c3 filter3 filter channel 3 c4 filter4 filter channel 4 c5 filter5 filter channel 5 c6 filter6 filter channel 6 ordering information part numbering information bumps package ordering part number 1 part marking 15 csp CM1400-03CP n003 note 1: parts are shipped in tape & reel form unless otherwise specified.
cm1400-03 rev. 3 | page 4 of 14 | www.onsemi.com specifications absolute maximum ratings parameter rating units storage temperature range -65 to +150 c dc power per resistor 100 mw dc package power rating 600 mw standard operating conditions parameter rating units operating temperature range -40 to +85 c
cm1400-03 rev. 3 | page 5 of 14 | www.onsemi.com electrical operating characteristics (see note1) symbol parameter conditions min typ max units r resistance 80 100 120 c capacitance at 2.5v dc 24 30 36 pf tcr temperature coefficient of resistance 1200 ppm/c tcc temperature coefficient of capac itance at 2.5v dc -300 ppm/c v diode diode voltage (reverse bias) i diode =10 a 6.0 v i leak diode leakage current (reverse bias) v diode =3.3v 100 na v sig signal voltage positive clamp negative clamp i load = 10ma 5.6 -1.5 6.8 -0.8 9.0 -0.4 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 level 4 note 2 30 15 kv kv v cl clamping voltage during esd discharge mil-std-883 (method 3015), 8kv positive transients negative transients notes 2 and 3 +10 -5 v v f c cut-off frequency z source =50 , z load =50 r=100 , c=30pf 58 mhz note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with respect to gnd, one at a time. note 3: clamping voltage is measured at the opposite side of the emi f ilter to the esd pin. for example, if esd is applied to pin a1, then clamping voltage is measured at pin c1.
cm1400-03 rev. 3 | page 6 of 14 | www.onsemi.com performance information typical filter performance (t a =25c, dc bias=0v, 50 ohm environment) figure 1. insertion loss vs. frequency (a1-c1 to gnd b2) figure 2. insertion loss vs. frequency (a2-c2 to gnd b2)
cm1400-03 rev. 3 | page 7 of 14 | www.onsemi.com performance information (cont?d) typical filter performance (t a =25c, dc bias=0v, 50 ohm environment) figure 3. insertion loss vs. frequency (a3-c3 to gnd b2) figure 4. insertion loss vs. frequency (a4-c4 to gnd b2)
cm1400-03 rev. 3 | page 8 of 14 | www.onsemi.com performance information (cont?d) typical filter performance (t a =25c, dc bias=0v, 50 ohm environment) figure 5. insertion loss vs. frequency (a5-c5 to gnd b2) figure 6. insertion loss vs. frequency (a6-c6 to gnd b2)
cm1400-03 rev. 3 | page 9 of 14 | www.onsemi.com performance information (cont?d) typical filter performance (t a =25c, dc bias=0v, 50 ohm environment) figure 7. comparison of filter response curves for cm1400-03 with dc bias
cm1400-03 rev. 3 | page 10 of 14 | www.onsemi.com performance information (cont?d) figure 8. filter capacitance vs. input voltage over temperature (normalized to capacitance at 2.5vdc and 25c) figure 9. resistance vs. temperature (normalized to resistance at 25c)
cm1400-03 rev. 3 | page 11 of 14 | www.onsemi.com application information parameter value pad size on pcb 0.240mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.290mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.300mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous 60 seconds maximum soldering temperature for lead-free devices using a lead-free solder paste 260c so ld er mask openi ng 0.29 0mm dia. no n-s old er mask de fin ed pad 0.24 0mm dia. sol der stenci l openi ng 0.30 0mm dia. figure 8. recommended non-solder mask defined pad illustration figure 9. lead-free (snagcu) solder ball reflow profile
cm1400-03 rev. 3 | page 12 of 14 | www.onsemi.com mechanical details csp mechanical specifications the cm1400-03 is supplied in a custom chip scale package (csp). dimensions are presented below. package dimensions package custom csp bumps 15 millimeters inches dim min nom max min nom max a1 2.915 2.960 3.005 0.114 8 0.1165 0.1183 a2 1.285 1.330 1.375 0.050 6 0.0524 0.0541 b1 0.495 0.500 0.505 0.019 5 0.0197 0.0199 b2 0.245 0.250 0.255 0.009 6 0.0098 0.0100 b3 0.430 0.435 0.440 0.016 9 0.0171 0.0173 b4 0.430 0.435 0.440 0.016 9 0.0171 0.0173 c1 0.180 0.230 0.280 0.007 1 0.0091 0.0110 c2 0.180 0.230 0.280 0.007 1 0.0091 0.0110 d1 0.575 0.644 0.714 0.022 6 0.0254 0.0281 d2 0.368 0.419 0.470 0.014 5 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters package dimensions for cm1400-03 chip scale package
cm1400-03 rev. 3 | page 13 of 14 | www.onsemi.com csp tape and reel specifications part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 cm1400-03 2.96 x 1.33 x 0.644 3.10 x 1. 45 x 0.74 8mm 178mm (7") 3500 4mm 4mm figure 12. tape and reel mechanical data
cm1400-03 rev. 3 | page 14 of 14 | www.onsemi.com on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to make changes witho ut further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any parti cular purpose, nor does scillc assume any liability arising out of the application or use of any pr oduct or circuit, and specific ally disclaims any and all liability, including without li mitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or spec ifications can and do vary in different applications and actu al performance may vary over time. all operating parameters, including ?typicals? must be validated for each custom er application by customer's technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not de signed, intended, or authorized for use as components in systems intended for surg ical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reason able attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303-675-2175 or 800-344-3860 toll free usa/canada fax : 303-675-2176 or 800-344-3867 toll free usa/canada email : orderlit@onsemi.com n. american technical support : 800-282-9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81-3-5773-3850 on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative

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